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B Hka Shakut Ai Unit

B Hka Shakut Ai Unit

Matut mahkai lam a matu hpaji rawng ai wa, B{0}} tara jeyang ai lam a matu hpaji rawng ai, B{1}}}} Series hte seng ai matut mahkai lam Module ningbaw ningla ni hpe 5{3}}} hpe tengman ai n-gun atsam hte bai htang ai lam ni hte matut mahkai nna, XYZ-axis linear hka garan jaw ai lam (±0.2μm) hte Z{8}}axis a 5.2μm) hte Z{8}}axis a ra ai lam ni hpe jaw ya ai. (±0.5 arc-sec, ±0.01N).
San sagawn ai lam hpe sa dat u

Product Introduction

Matut mahkai lam a matu hpaji rawng ai wa, tara tawt lai ai ni a matu, B- seng nna, Module ningbaw ningla ni5-DOF shut ai lam hpe gram lajang ai lam hpe hpawng de da ain-gun atsam hte n-gun jaw ai lam ni hpe jaw ya ai, synchronized XYZ-axis linear hka garan ai lam (±0.2μm) hte Z{3}}axis angular/force hka garan ai lam (±0.5 arc{5}}sec, ±0.01N) hpe jaw ya ai. Ndai masa gaw, semiconductor packaging, tsi mawan ni hpe shinggyin la lu ai, nbungli hte matut mahkai ai lam ni hta hkrak ai lam hpe bai masat da ya ai, dai shara hta matut mahkai hpung ni gaw, arung arai ni a hkam kaja lam hpe dawdan ya ai.

Dai zawn hka lim aitri-}modal sensor arrayinterferometric shara jaw ai, piezoelectric torque hkam sha lam, amyu bawsang-}uguge n-gun shadawn ai lam ni hpe kayau kaya galaw ai.Micron- madang na n-gun hpe hkang ai (±0.01N) hte hkrak ai daw ni hpe bang nna, n-gun dat ai lam ni hpe jat ya ai.. Aluanti{0}}overshot algorithms ni1000Hz n-gun galai shai ai lam hpe lu la na matu – servo-press system ni hta 5× grau lawan ai.

 

 

Core Hpaji Masa Hpe Hkam La Ai Lam Ni
1

Zero- N-gun galai shai ai lam

0.1N bang ai kaw nna 50N 100 daram hpe dip ai.<3ms.

2

Active Vibration hpe hkra machyi shangun ai

65% shayawm ai gaw, tsaw ai-G makau grup yin ni hta re.

3

Hkring mang n-gun n-gun n-gun n-gun n-gun n-gun n-gun n-gun n-gun n-gun n-rawng ai ni

-20℃kaw nna 85℃du hkra ±0.5% FS a hkrak ai lam hpe hkan sa u.

4

ISO 13845 / IPC{{1}J{2}} STD-001 hpe hkan sa ai

Tsi hte nbungli hte seng ai electronic ni a matu masat da ai.

 

Sasana- tara tawt lai ai lam ni hta masat da ai

Tsi tsi ra ai lam

Inserts 0.2mm hypodermic tubes with 0.008N consistency (CPK>2.0).

Server Socket Mounting

15N ±0.03N hta 2,096-pin connector ni hpe dip nna, pin colllanarity sum mat ai hpe pat shingdang ya ai.

Aerospace Fuel Cell gat shingjawng ai lam

ultrasonic welding galaw ai shaloi 25N ±0.05N compression hte bonds ni hpe garan jaw ai.

GaN Power Module Packging

8N ±0.01N die- tattoo hpe lang nna, void byin pru wa ai hpe 70% shayawm ya lu ai.

 

Module a PROFINET IRT interface gaw<125μs cycle times with collaborative robots. Gold-plated EMI shielding exceeds IEC 61000-4-3 Level 4, while hermetically sealed optics survive 100 steam sterilization cycles. NIST-traceable force calibration ensures 99.8% confidence over 10 million operations.

Anhte a n-gun-sensitive assembly guide hpe download galaw uB-Saeries modules ni gaw tsi mawan ni a n-gun hpe 52% shayawm nna, semiconductor package hpe 38% jat ya ai hpe sawk sagawn na matu.

 

Hot Tags: b hka garan jaw ai hpung, Miwa b hka hka jaw ai hpung, dut mari ai ni, jak rung ni

San sagawn ai lam hpe sa dat u

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